MBRA210ET3 surface mount schottky power rectifier sma power surface mount package this device employs the schottky barrier principle in a metal ? to ? silicon power rectifier. features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. typical applications are ac/dc and dc ? dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? low i r , extends battery life ? 1st in the market place with a 10 v r schottky rectifier ? compact package with j ? bend leads ideal for automated handling ? highly stable oxide passivated junction ? guardring for over ? voltage protection ? optimized for low leakage current ? pb ? free package is available mechanical characteristics ? case: molded epoxy ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 70 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? polarity: polarity band indicates cathode lead ? esd ratings: machine model = c human body model = 3b device package shipping ? ordering information MBRA210ET3 sma 5000/tape & reel schottky barrier rectifier 2 amperes 10 volts sma case 403d plastic marking diagram b2e1 ayww b2e1 = device code a = assembly location y = year ww = work week = pb ? free package MBRA210ET3g sma (pb ? free) 5000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. product specification 1 of 2 4008-318-123 sales@twtysemi.com http://www.twtysemi.com
package dimensions sma case 403d ? 02 issue d 4.0 0.157 2.0 0.0787 2.0 0.0787 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 1.92 2.17 2.27 0.076 inches a1 0.05 0.10 0.15 0.002 b 1.27 1.45 1.63 0.050 c 0.15 0.28 0.41 0.006 d 2.29 2.60 2.92 0.090 e 4.06 4.32 4.57 0.160 l 0.76 1.14 1.52 0.030 0.085 0.089 0.004 0.006 0.057 0.064 0.011 0.016 0.103 0.115 0.170 0.180 0.045 0.060 nom max 4.83 5.21 5.59 0.190 0.205 0.220 h e e bd l c a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 403d ? 01 obsolete, new standard is 403d ? 02. polarity indicator optional as needed (see styles) h e product specification 2 of 2 4008-318-123 sales@twtysemi.com http://www.twtysemi.com
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